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HPSP High Pressure Annealing Furnace

High Pressure Annealing Furnace

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Description

High Pressure Annealing Furnace
- Pressure: 1 – 25 ATM
 •BKM – 20 ATM
- Temperature: 300°C – 450°C
 •BKM – 400 °C
- Annealing / Diffusion various gases
 •BKM – 100%H2 or D2
N2 Load Lock to minimize O2 level
- Less 10ppm
Batch Process
- 75 wafers batch for HVM
- Tput ~ 18 wph (BKM process)
Automated High Volume Production
- SECS / GEM300 factory compliant
SEMI S-2 / CE Compliance