Description
Automated Plasma Resist Strip/Descum System.
Main Features:
- Wide range of application
- High strip rate with no defects/damage due to unique Plasma Source
- Low Capital Cost and Lower CoO, verylow footprint (0.74 sq. m)
- Simple Reliable System with state of the art components and low gas consumption
- Continuous running with water-cooled source – ensures repeatable process
- Flexible systems with controlled O or H species – no F usage
- Only 3 moving parts
Standard Certification:
Application:
- PR strip/Descum, CuO reduction, Bond pad clean/anneal, etc.
Specification:
- High Removal Rate for PR a) ~10 microns/min @ 250°C
- High Removal Rate for Polymide a) >4um/min @ 200°C
b) Control down to 100Å/min