Description
Automated High Temperature Vacuum Cure System for Polyimide Process Cure.
Main Features:
- Production Proven Platform in HVM
- Lower CoO and Higher Throughput
- 100 Wafers Processing Simultaneously
- Vacuum cure at Lower Pressure
- Laminar Flow Parallel to Each Wafer
- No outgassing yields superior post-processing results
- Pre-cure Pump/Purge Cycles Resulting in <10 ppm Oxygen
- 5-zone Temp Control with High Forced Cooling
Standard Certification:
Application:
- Polyimide/BCB/PBO/Low temp polymer cure for advance packaging.
- Wafer to wafer bonding anneal
Specification: