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SCIENTECH
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YES ÉcoClean
WetBench
Single Wafer Wet Process Tool
Temporary Bonding De-bonding Glass Recycle Tool
ExOne
Genmark Robot Series
Genmark Pre-aligner Series
KINIK
MDC
HPSP High Pressure Annealing Furnace
RAVE
SMEE
SiGlaz
Towa lasermark1
towa-lasermark2
YES VertaCure
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協作平台擁有者
Scientech辛耘企業
Kym Lim
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Territory coverage for Sales and Services
SE Asia customers
SCIENTECH
WetBench
Single Wafer Wet Process Tool
Temporary Bonding/De-bonding/Glass Recycle Tool
ClassOne
High Quality Refurbished Semitool Equipment.
Deringer-Ney
Cantilever Needle
Cobra Needle
Wire Needle
ExOne
Advanced 3D Metal Printer (Direct Additive MFG) and 3D Sand Printer using Binder Jet technology for Rapid Industrial production and Prototyping
Forward Science
Pump Overhaul Services
Genmark
Robot Series
Pre-Aligner Series
KINIK
8" & 12" reclaimed wafers / prime wafers, Ultra flatness and diamond wafers
MDC
Leaders in high and ultra-high vacuum components
HPSP
High Pressure Anneal Process
T
T
T
RAVE
Rhazer
™ Haze Removal System
SMEE
SSB245/10 Projection Lithography
T
T
SiGlaz
Defect Map Analysis
TMC
Specialize in Active and Passive vibration cancellation system, EMI & Acoustic.
Towa
Wafer Marker SL473 Series (wafer mark)
Wafer Marker SL473 Series (wafer mark)
YES
YES-VertaCure
YES-ÉcoClean
YES-ÉcoCoat Vapor Phase Deposition System
Neutronix Quintel
Mask alignment systems for the Semiconductor, Microelectronics, LEDs, MEMs etc